Laird updates HCI modules with Bluetooth v4.2 dual-mode connectivity
Laird announces Bluetooth-qualified Class 1 HCI modules for rapid enablement of Bluetooth technology into OEM devices.
The BT850, BT851, and BT860 series complements Laird’s original BT8x0 series of dual-mode Bluetooth v4.0 modules. This adds support for the Bluetooth v4.2 BR/EDR/LE core specification in Classic Bluetooth and Bluetooth Low Energy (BLE). The modules are equipped with silicon from Cypress Semiconductor.
The BT850 and BT860 series provide more options for OEM customers through enhanced throughputs and security benefits in the Bluetooth v4.2 specification for end devices.
The small form factor devices leverage the Cypress CYW20704 A2 chipset and integrate RF components for a design with full RF and regulatory certifications, while still providing design flexibility for customers to implement options such as USB (BT850) or UART (BT860) host interface, or integrated versus external antenna implementations.
The BT851 USB dongle provides OEM and Bluetooth system providers a simple external plug-in option for enabling their operating system-enabled devices with robust Bluetooth v4.2 connectivity, adds Laird.
Today, there are billions of wirelessly connected devices, and that number continues to grow. The addition of Bluetooth 4.2 to Laird’s HCI module portfolio provides pin-to-pin compatible solutions with enhanced security, including AES-128, Diffie-Hellman pairing, and link layer privacy. This enables customers to easily develop smart, secure, and power-conscious devices for a greater number of IoT deployments or easily upgrade from original BT8x0 designs without any footprint, or hardware changes.
The BT850 and BT860 modules are designed to support a USB or UART host interface, additionally I2S and PCM audio interfaces plus GCI co-existence.
These Laird devices also provide native support for Windows, Linux and Android Bluetooth software stacks. All Laird products are fully qualified by the Bluetooth SIG as a Hardware Controller Subsystem, which allows designers to integrate their existing pre-approved Bluetooth Host and Profile subsystem stacks to simply and easily gain Bluetooth approval for their products.
Engineering samples of all BT850, BT851, and BT860 devices are now available. Modules and kits are expected to be commercially available in January 2018, with all stated RF certifications. A fully featured low-cost developer’s kit is available for prototyping, debug, and integration testing for each module variant.
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